Skyray Xrf Plating Thickness Analyzer for Contact Bins and Gold Wires

Product Details
Customization: Available
After-sales Service: International Warranty
Application: Plating Thickness Test
Manufacturer/Factory & Trading Company

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Number of Employees
659
Year of Establishment
2006-07-04
  • Skyray Xrf Plating Thickness Analyzer for Contact Bins and Gold Wires
  • Skyray Xrf Plating Thickness Analyzer for Contact Bins and Gold Wires
  • Skyray Xrf Plating Thickness Analyzer for Contact Bins and Gold Wires
  • Skyray Xrf Plating Thickness Analyzer for Contact Bins and Gold Wires
  • Skyray Xrf Plating Thickness Analyzer for Contact Bins and Gold Wires
  • Skyray Xrf Plating Thickness Analyzer for Contact Bins and Gold Wires
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  • Overview
  • Product Description
  • Product Parameters
Overview

Basic Info.

Model NO.
Thick
Warranty
> 1Year
Detection Method
Spectroscopic
Advantage
High Resolution
Principle
Xrf
Wavelengths
X-ray
Dispersive Element
Sdd Detector
Light Number
Xrf
Certification
RoHS, CE
Customized
Customized
Measurement Range
From K to U
Net Weight
96kg
Packing Size
73*58*70
Certificate
CE, ISO
Transport Package
Standard International Packing
Trademark
skyray instrument
Origin
Jiangsu, China
HS Code
90273000
Production Capacity
280units/Month

Product Description

Product Description

Instrument introduction

Thick800A is the professional XRF plating thickness analyzer.  It is with full-auto software operation, multi-point testing, software controlling the instrument and movable platform.
 
Product Parameters

Instrument Features

  1. Top-lightening
  2. Test parts can be lifted up and down
  3. High-precision moveable platform
  4. Small collimator
  5. High-resolution SDD detector
  6. Visual operation
  7. Auto locate height
  8. Auto search test spot
  9. Mouse locates the test point
  10. Super large chamber design

Applications fields:

Thickness test of gold, silver, Rhodium plated jewelries
PCB factory
Electro plating factory 
Ect.

 
Technical Specifications
Measurable elements: Sulfur ( S ) - Uranium ( U )
Plating Thickness up to 20um
Repeatability: 0.1%
Stability: 0.1%
Energy Resolution 135eV
Power: AC 220V ± 5V or AC 110V ± 5V. AC purified voltage power supply
Sample chamber size: 52cm x 40cm x 15cm
Size: 69cm x 57cm x 66cm
Work Temperature: 15ºC -30 ºC
Skyray Xrf Plating Thickness Analyzer for Contact Bins and Gold Wires

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